One of the fastest growing process technology sectors within the semiconductor industry, Chemical Mechanical Planarization (CMP) systems use a mechanical polishing pad in conjunction with special chemical abrasives, which are needed to achieve a smooth and uniform wafer topography. This process not only allows more interconnect layers to be deposited onto the wafer, but also enables finer circuit patterns to be achieved. 

Wolfe Engineering has been providing and supporting delivery modules for CMP applications since 1995. Wolfe’s dedicated engineering/manufacturing team is focused on designing and producing everything from support modules to turnkey integrated “super-systems.” Wolfe is considered by its customers to be the industry expert in the field of liquid distribution and management systems.