CU Deposition

Wolfe Engineering is helping the semiconductor industry perpetuate Moore’s Law by supporting the transition to copper from traditional aluminum interconnects. As the industry aggressively pioneers the use of copper deposition in advanced generation semiconductor devices, Wolfe Engineering is providing specialized liquid management systems for the safe delivery of the constituents required in this electroplating process. 

Wolfe is ensuring long-term success for this technological breakthrough by providing environmentally safe solutions for recovery and reclamation of the effluent chemistries generated by the copper deposition process. 

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