Epoxy Applications are typically used for heat transfer requirements between 2 different materials. i.e, Copper and Stainless.

Because epoxies are insulators and very poor thermal conductors, fillers must be introduced into the epoxy in order to provide thermal transfer. The thermal conductivity of an epoxy will be determined by the choice of filler. Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads.

Wolfe Engineering has the expertise to utilize Epoxy Applications to its full potential.